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Advanced Packaging Engineer

Company: SkyWater Technology Foundry
Location: kissimmee
Posted on: May 3, 2021

Job Description:

SkyWater is co-creating the next wave of computing by operating a unique business model that enables innovative technology developers to utilize our advanced processing expertise and volume-manufacturing capabilities to bring their revolutionary products to market. This puts SkyWater at the center of a technology revolution as we exit the smartphone era and into the age of 5G and artificial intelligence. Joining our team means contributing to commercialization of some of the most exciting technologies the world has ever seen including superconducting and 3D ICs, carbon nanotube and photonic logic devices, Micro Electro-Mechanical Systems (MEMS) and other emerging device topologies.We cultivate an environment of learning and invest in further developing the knowledge of our highly skilled and dedicated employees. We provide them with a dynamic workplace, open communication and an opportunity to grow within the company. If you're searching for a company where you can be apart of the next level of technology and truly make a difference, consider joining SkyWater today!Position Summary:In this highly visible role, you will own tools and develop processes on advanced package tools, help choose new tooling, interact with suppliers, and be part of a team responsible for packaging integration and package technology development including advanced 2.5D/3D packaging for a variety of projects. Excellent oral and written communication skills are required to communicate ideas with foundry customers, colleagues, and management.Responsibilities:Develop or integrate robust manufacturable post-fab process for foundry customers.Analyze data from production and engineering process runs, qualifying changes or additions to manufacturing toolsets and process flows.Partner with foundry customers, product teams, and manufacturing engineering to demonstrate manufacturability, reliability and the smoothly transition packaging technologies from concept to manufacturing with high yield and cost effectiveness.Works with suppliers to obtain specifications on new equipment, materials, and/or products as need to fulfill customer requirements.The job also requires performing other duties as assigned. Percentages of time spent on job duties are estimates and may vary for each position.Required Qualifications:Education: BS/MS/PhD in electrical engineering, microelectronics, chemical engineering, other related discipline.Experience and Skills:3+ years' experience in backend interposer/assembly/package fabrication processes and process flow.Experience in one or more of: deposition, photolithography, etch, bonding/debonding, backgrind/backmetal, electroplating.Understanding of existing and advanced packaging technologies, assembly processes, IC packaging materials, reliability standards, FA techniques, etc.Hands-on experience with advanced packaging techniques including fan out/in, RDL, 3D, 2.5D and wafer level packaging.Integration, such as wafer bump, RDL, solder sphere, ball drop, electrochemical or electroless plating of one or more typical bump metallurgies (Pb/Sn, SnAgCu, SnAg, Cu, Ni, etc).Wafer processing tools and metrology knowledge/experience.Working knowledge in materials characterization and analysis .Wafer bumping, Solder sphere transfer / ball drop processing or packaging lines.Experience with data gathering (queries), processing, and analysis.Experience in low volume/high product mix environments.Knowledge of DOE, SPC, and 6-sigma concepts and applications.Clear problem-solving capability, data driven, inventive solution oriented and can articulate thought processes.US Citizenship Required: This position will require the holding of or ability to obtaingovernment security clearance which requires U.S Citizenship.Preferred Qualifications:Education: MS/PhD in electrical engineering, microelectronics, chemical engineering, other related discipline.Experience and Skills: Project Management skills and/or defined training.SkyWater Technology offers competitive pay, a comprehensive benefits package including benefit eligibility day one, paid time off, paid holidays, matching 401(k), an on-site workout facility, an on-site, self-serve market and so much more!SkyWater is an Equal Opportunity/Affirmative Action Employer. Applicants for all job openings are welcome and will be considered without regard to age, sex, sexual orientation, gender identity, transgender status, pregnancy, childbirth or related medical condition, race, color, creed, religion, national origin, ancestry, physical or mental disability, genetic characteristics, medical conditions, family care or medical leave status, military service or status as a Protected Veteran, marital status, familial status, membership or activity in a local human rights commission, status with regard to public assistance, or any other basis protected by applicable federal, state or local laws ("Protected Characteristics"). SkyWater complies with all applicable federal, state and local laws concerning EEO/AA employment.SkyWater complies with federal and state disability laws and makes reasonable accommodations for applicants and employees with disabilities. If reasonable accommodation is needed to participate in the job application or interview process, to perform essential job functions, and/or to receive other benefits and privileges of employment, please contact Human Resources at 952-851-5200 or Human_Resources@Other detailsPay Type SalaryApply NowKissimmee, FL, USA

Keywords: SkyWater Technology Foundry, Kissimmee , Advanced Packaging Engineer, Other , kissimmee, Florida

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