Engineer Microelectronic Semiconductors / Principal Engineer Mic with Security Clearance
Company: Northrop Grumman
Location: Apopka
Posted on: April 23, 2024
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Job Description:
At Northrop Grumman, our employees have incredible opportunities
to work on revolutionary systems that impact people's lives around
the world today, and for generations to comeOur pioneering and
inventive spirit has enabled us to be at the forefront of many
technological advancements in our nation's history - from the first
flight across the Atlantic Ocean, to stealth bombers, to landing on
the moonWe look for people who have bold new ideas, courage and a
pioneering spirit to join forces to invent the future, and have fun
along the wayOur culture thrives on intellectual curiosity,
cognitive diversity and bringing your whole self to work - and we
have an insatiable drive to do what others think is impossibleOur
employees are not only part of history, they're making history.
Northrop Grumman Mission Systems is seeking a talented and
motivated Microelectronics Manufacturing Process Engineer for our
Advanced Packaging Technology --Line in Apopka, FloridaNorthrop
Grumman's semiconductor foundry, packaging, integration, and test
lines have unique capabilities of supporting a range of production
microelectronics and providing leading-edge technology
developmentThe Apopka Florida wafer bumping --Line will support
flip chip, 2.5D, and 3D packaging for internal and external
production customers as well as emerging technology programsThe
line will provide a range of bump compositionsTechniques will
include sputter, electro-plating, and solder-sphere transfer to
support flip chip, 2.5D, and 3D packaging using 100 mm to 300mm
wafersThe devices supported in Apopka will also be subjected to
singulation and die/wafer probe testingThe Engineer Microelectronic
Semiconductors/Principal Engineer Microelectronic Semiconductors
will provide manufacturing and development technical support and
direction on a wide range of bumping processesResponsibilities
include, but are not limited to, the tasks outlined below:
* Support multiple wafers bumping processes.
* Support development and leading the aspects of the qualification
of new bump and micropump compositions and process flows.
* Working with cross-site program, test, and reliability teams to
achieve package qualifications and troubleshoot manufacturing and
development issues.
* Ability to understand program package requirements and support
advisement on suitable bump metallurgies and process flows as
applicable.
* Solving manufacturing problems related to materials, designs,
equipment, and people on time to support production.
* Developing new and maintaining existing manufacturing processes
with a focus on affordability, sustainability, and quality
* Developing and revising process documentation and work
instructions
* Monitoring process yields, cost, and process stability and
capability
* Supporting the creation and implementation of improvement plans
based on the above metrics.
* Developing ROI justification for process improvements
* Assisting with the training of new personnel and participating in
the design of operator training materials
* Supporting factory maintenance personnel with the troubleshooting
and repair of process equipment
* Leading/facilitating Root Cause & Corrective Action
investigations using 8D Problem Solving methodologies.
* Supporting capital equipment projects through procurement,
installation, and release for production use
* Supporting engineering data analysis including metrology data,
ERP (SAP) data, and other in-process metricsThe chosen candidate
must have excellent verbal and written communication skills; be
able to multi-task in a fast-paced, dynamic, and high-visibility
environment; and work well as part of a teamBasic Qualifications
for an Engineer Microelectronic Semiconductors:
* Bachelor's degree or higher in Engineering or other related STEM
area and at least two (2) years of experience in
Manufacturing/Process Engineering, Production, or related area - OR
- a master's degree
* Manufacturing/Process Engineering experience in a high-volume
semiconductor manufacturing environment
* Knowledge of relevant semiconductor processes, such as
electrochemical plating, electroless plating, contact lithography,
spin-on resists wet chemical processing, thin spin sputter
deposition, and solder sphere bump processing.
* Familiarity with the Design of Experiments (DOE), Statistical
Process Control (SPC), 6 Sigma concepts for process development and
control
* Experience in technical data collection, organization, and
analysis skills.
* Proficient in data analysis techniques/programs.
* Excellent oral and written communication skills and a strong
attention to detail.
* Work efficiently in a group as an individual contributor.
* Knowledge and an understanding of project management.
* Fluency in MS Office software applications
* Familiarity with ERP systems; SAP preferred.
* US Citizenship is required.Basic Qualifications for a Principal
Engineer Microelectronic Semiconductors:
* Bachelor's degree or higher in Engineering or other related STEM
area and at least five (5) years of experience in
Manufacturing/Process Engineering, Production, or a related area -
OR - a master's degree and three (3) years of experience
* Senior Manufacturing/Process Engineering experience in a
high-volume semiconductor manufacturing environment with direct
process ownership of one or more process areas
* Complete understanding and wide application of technical
knowledge of relevant semiconductor processes, such as
electrochemical plating, electroless plating, contact lithography,
spin-on resist wet chemical processing, thin spin sputter
deposition, and solder sphere bump processing.
* Provides technical solutions to a wide range of complex and
difficult problems.
* Independently determines and develops an approach to
solutions.
* Represents the organization in providing solutions to difficult
technical issues associated with specific projects.
* Expert in the Design of Experiments (DOE), Statistical Process
Control (SPC), and 6 Sigma concepts for process development and
control
* Excellent data collection, organization, and analysis skills
* Proficient in data analysis techniques/programs.
* Excellent oral and written communication skills and a strong
attention to detail.
* Ability to work independently (highly self-motivated)
* Work efficiently in a group as a technical leader and a
contributor.
* Advanced knowledge of project management and experience leading
cross-functional project teams.
* Fluency in MS Office software applications
* Familiarity with ERP systems; SAP preferred.
* US Citizenship is required.Preferred Qualifications:
* Experience with Matlab, VBA, and/or similar.
* Experience with CAD software (AutoCAD, NX, or similar)
* Experience with Minitab software.
* Experience with SAP MRP software.
* Experience with UBM and solder bump metallurgy and how they
impact package reliability.
* Experience with both lead and lead-free bump technologies.
* Experience in flip-chip, 2.5D, and 3D packaging.
* Active Secret Clearance
* Blackbelt CertificationMANUMS Salary Range: $75,300 -
$112,900
Salary Range 2: $92,600 - $139,000 The above salary range
represents a general guideline; however, Northrop Grumman considers
a number of factors when determining base salary offers such as the
scope and responsibilities of the position and the candidate's
experience, education, skills and current market
conditionsEmployees may be eligible for a discretionary bonus in
addition to base payAnnual bonuses are designed to reward
individual contributions as well as allow employees to share in
company resultsEmployees in Vice President or Director positions
may be eligible for Long Term IncentivesIn addition, Northrop
Grumman provides a variety of benefits including health insurance
coverage, life and disability insurance, savings plan, Company paid
holidays and paid time off (PTO) for vacation and/or personal
business.
The application period for the job is estimated to be 20 days from
the job posting dateHowever, this timeline may be shortened or
extended depending on business needs and the availability of
qualified candidatesNorthrop Grumman is committed to hiring and
retaining a diverse workforceWe are proud to be an Equal
Opportunity/Affirmative Action Employer, making decisions without
regard to race, color, religion, creed, sex, sexual orientation,
gender identity, marital status, national origin, age, veteran
status, disability, or any other protected classFor our complete
EEO/AA and Pay Transparency statement, please visit
http://www.northropgrumman.com/EEO U.SCitizenship is required for
all positions with a government clearance and certain other
restricted positions.
Keywords: Northrop Grumman, Kissimmee , Engineer Microelectronic Semiconductors / Principal Engineer Mic with Security Clearance, Engineering , Apopka, Florida
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